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Currently Browsing: Results for Tag "TSV"

Samsung aims to conquer the memory market with HBM3

Samsung aims to conquer the memory market with HBM3 As we’ve discussed previously, HBM stacks memory chips on top of each other around a central core.The advantage is vastly increased memory bandwidth and much lower power consumption compared with GDDR5.

Intel Can Now Mesh Different Process Nodes on the Same Chip

Intel Can Now Mesh Different Process Nodes on the Same Chip One constant of CPU manufacturing for decades has been that different components on the same die must share a common process node.At Hot Chips last week, however, the chip manufacturer showed off something different — a new packaging solution that offers an alternative to expensive 2.