search slide
search slide
pages bottom
Currently Browsing: Results for Tag "EUV"

Samsung: Full speed ahead for 10nm, EUV deploys at the 7nm node

Samsung: Full speed ahead for 10nm, EUV deploys at the 7nm node For the past 12 months, Samsung’s foundry division has occupied a leadership position at the 14nm node.The image above shows why companies continue to claw for EUV lithography, despite its problems, power costs, and vastly increased cooling requirements.

ARM announces new Artemis CPU core, first 10nm test chip, built at TSMC

ARM announces new Artemis CPU core,  first 10nm test chip, built at TSMC As of yesterday, ARM is announcing that it has successfully validated a new 10nm FinFET design at TSMC.The unnamed multi-core test chip features a quad-core CPU from ARM, codenamed Artemis, a single-core GPU as a proof of concept, and the chip’s interconnect and other various features.

GlobalFoundries announces new 7nm FinFET process, full node shrink

GlobalFoundries announces new 7nm FinFET process, full node shrink Even more interesting is the fact that the company intends to execute a full node shrink at 7nm, rather than using a hybrid node.A quick word on “full node” versus “hybrid node.

Samsung announces fourth-gen 14nm node, plans 10nm improvements, and shows off 7nm EUV wafer

Samsung announces fourth-gen 14nm node, plans 10nm improvements, and shows off 7nm EUV wafer Like Intel, Samsung intends to offer multiple generations of a single process node — but unlike Intel, it isn’t debuting a new strategy in lieu of maintaining a quick transition roadmap.When foundries add new iterations of existing process nodes, it’s typically because they’ve got customers who are interested in those process nodes and want to take advantage of them.